香港科技大学集成电路设计工程硕士课程点评

　　香港科技大学集成电路设计工程硕士专业介绍
　　过去三十年，集成电路(IC)技术驱动了整个电子行业的发展。未来三十年，集成电子技术从微米尺度向纳米尺度演进，将是信息技术发展的关键。我们日常生活中和集成电路产品打交道，要从移动电话和计算机算起。如果不用集成电路，MP3播放器和电子游戏站等娱乐电子产品就发挥不1%的功能;汽车安全设备如高效注油系统和自动刹车系统就根本不存在;医疗植入仪器，如心脏起博器，就不是5克而是500克。保安和存货管理用的智能卡和射频鉴别标签(RFID)，每年用上了千万张，而需求正以幂数级增长。显然，信息社会的持续及进步，正是依靠了集成电子技术的发展。

　　香港科技大学集成电路设计工程硕士课程目标
　　香港科技大学集成电路设计工程硕士(MSc(ICDE))旨在为中国大陆和香港培养IC设计工程师。香港科技大学集成电路设计工程硕士课程是为持有理学或工学学士学位而又有志于汲取深入广博的集成电路设计知识的专业人员和学生度身定做。香港科技大学集成电路设计工程硕士课程的设计符合香港科技大学授予理学硕士学位的要求。

　　香港科技大学集成电路设计工程硕士课程设置
　　要完成香港科技大学集成电路设计工程硕士课程，学员必须完成八门授课学科(3个学分x6 加2个学分x2)和一门设计课程(4个学分)。

　　学科目录
　　1、 EESM 5000 CMOS VLSI 设计
　　[Previous Course Code(s): EESM 501] CMOS process and design rules; MOS device electronics; CMOS circuit and logic circuit characterization and performance estimation; VLSI design and verification tools. Project work will be centered on industry standard tools.

　　2、 EESM 5020 数位式VLSI电路系统设计与自控式设计
　　[Previous Course Code(s): EESM 516] Structured design styles, specification, synthesis and simulation using hardware descriptive language (HDL), structural chip design and system design, circuit design of system building blocks: arithmetic unit, memory systems, clocking and performance issues in system design, design-automation tools and their applications, introduction to testing. Exclusion(s): ELEC 5160

　　3、 EESM 5030 VLSI信号处理结构
　　[Previous Course Code(s): EESM 518] VLSI architecture design for digital signal processing applications such as multimedia and communication systems will be covered; general techniques such as pipelining, retiming, folding and unfolding, and systolic array design will be discussed; algorithmic/architectural tradeoff in power and performance will be studied; example applications in video processing and wireless communication architectures will be provided. Background: ELEC 5160 or EESM 5020

　　4、 EESM 5060 Embedded Systems
　　[Previous Course Code(s): EESM 5900A] This course introduces trends and design strategies for embedded systems. It will give a holistic view of embedded system design using smart phone as an example. It covers the basic hardware and software components involved in a complex embedded system. It also covers the design and use of System-on-a-chip (SoC) in embedded systems. The course will also discuss the design issues such as testability and power considerations. Hands-on experience will be provided.

　　5、 EESM 5100 模拟集成电路分析和设计
　　[Previous Course Code(s): EESM 503] Current sources, output stages, operational amplifiers, frequency response, feedback analysis, stability and compensation, slew rate, advanced integrated-circuit design techniques, analog VLSI building blocks.

　　6、 EESM 5120 高级模拟集成电路分析和设计
　　[Previous Course Code(s): EESM 504] Noise analysis, advanced op-amp design techniques, analog VLSI building blocks, multipliers, oscillators, mixers, phase-locked loops, A/D and D/A converters, passive filter design, frequency scaling, active filter design. Exclusion(s): ELEC 5040Background: ELEC 4420 and ELEC 4510

　　7、 EESM 5200 集成电路设计的半导体器件
　　[Previous Course Code(s): EESM 506] Review of MOSFET characteristics, device modeling for circuit simulation (SPICE models), the BSIM MOSFET models, other semiconductor models, circuit model parameter characterization, design guard-band and statistical modeling.

　　8、 EESM 5310 Power Management Circuits and Systems
　　The course will cover power management circuits such as voltage references, linear voltage regulators, switched-inductor and switched-capacitor power converters; and power management systems for energy harvesting, RFID and bio-medical implants.

　　9、 EESM 5320 Radio-Frequency Integrated Circuits Design
　　The course will cover radio-frequency circuit design techniques for wireless transceivers. At the end of the course, students should be familiar and acquire basic knowledge in transceiver architecture and integration, low-noise amplifiers, mixers, synthesizers, phase-locked loops, VCOs, and power amplifiers.

　　10、 EESM 5810 High-Tech Innovation and Entrepreneurship
　　[Previous Course Code(s): EESM 5900E] This interdisciplinary class combines a technical survey of emerging technologies/innovation and training in practical high-tech entrepreneurship. The class surveys a few major areas of innovation that will change the future landscape of the high-tech industry, with notable guest lecturers providing business cases and industry perspective. The class also introduces practical entrepreneurship principles for business development. Students learn important skills such as building teams and attracting talent, developing a product/technology roadmap, marketing and selling an idea, structuring a company, managing rapid growth, raising venture funds, forming strategic partnerships, and developing an intellectual property strategy.

　　11、 EESM 5900 专题课 *
　　[Previous Course Code(s): EESM 600] Selected topics of current interest. May be repeated for credit if different topics are covered.
　　- EESM 5900C Principle of Enabling Device Technology for Electronic Circuits (3个学分)
　　- EESM 5900D Project Management for Advanced Electronic & Computing Engineering (3个学分)
　　- EESM 5900E High-Tech Innovation and Entrepreneurship (3个学分)

　　12、 EESM 5920 模拟集成电路系统和设计的专题学习
　　[Previous Course Code(s): EESM 692] Selected topics in analog and mixed-signal IC design drawn from disciplines such as RF/microwave IC design, integrated power electronics, imager design, micro-sensor design and micro-display design. Two to three selected topics will be discussed in depth that put emphasis on system level considerations as well as functional blocks design. Background: ELEC 4420, EESM 5100

　　13、 EESM 6980 理学硕士毕业设计
　　[Previous Course Code(s): EESM 698] Independent project carried out under the supervision of a faculty member. This course may be run repeatedly for credit(s). Exclusion(s): ELEC 698 (prior to 2010-11)
　　除EESM 6980(值4学分)、EESM 5310和EESM 5320(各值2学分)外，以上所有课均值3学分。
　　*学员可以修读最多六个学分的EESM 5900课目。
　　为了囊括最新的IC设计工程技术和论题，以上课程目录可能会有所修改。
　　经课程主任批准后，学员可以修读由其他自资理学硕士课程开设的最多九个学分的课目，其中包括：
　　理学硕士(电子工程学)课程或理学硕士(电信学)课程中选修最多九个学分的课目，或者从非EESM课目中选修最多三个学分的课目

　　香港科技大学集成电路设计工程硕士申请要求
　　1、 招收对象
　　香港科技大学集成电路设计工程硕士(MSc(ICDE))项目的招收对象为希望提升集成电路学科知识的学生和专业人员。我们亦鼓励成绩优异的应届毕业生提出申请。
　　2、 入学要求
　　1) 申请者必须持有电子工程学、工程科学或物理科学学士学位，或者持有受认可的大学的同等学历资格。
　　2) 英语要求
　　a) 托福考试(TOEFL) 笔试(PBT)分数 ≥ 550网络考试(iBT)分数 ≥ 80
　　b) 雅思考试(IELTS) 总分数 ≥ 6.0所有测试项目的分数 ≥ 5.5

　　香港科技大学集成电路设计工程硕士教学语言
　　所有课程讲授和教学资料均为英语。

　　香港科技大学集成电路设计工程硕士学分转换
　　学员在其他院校完成获得承认的课目，可以准予学分转换。学员必须在入学后第一个学期内向课程办公室提出申请。学分转换须经课程主任批准承认，并符合课程、学院及大学对学分转换的一般要求。经批准后最多可转换3个学分。

　　香港科技大学集成电路设计工程硕士课程费用
　　学费为港币120,000元，允许转换学分的新学员也需缴付全额学费。学员修读额外学课或未能完成某些学课而要重修，需再为每3个学分缴付港币15,000元。